fixed footprint for P/J1, improved footprint fo TSSOP38 by reducing solder mask clear...
authorDoug Coffland <dougcoffland@gmail.com>
Wed, 23 Nov 2016 02:24:44 +0000 (18:24 -0800)
committerDoug Coffland <dougcoffland@gmail.com>
Wed, 23 Nov 2016 02:24:44 +0000 (18:24 -0800)
commit07736d6a17f6ac78c7cb41cc550c99582292f1d2
treeacbc3371b5b93ae880383de5a26d829d10181059
parent70b34c39efaac6ff6d008e6061fb9f3b067c2aed
fixed footprint for P/J1, improved footprint fo TSSOP38 by reducing solder mask clearance, moved non-ISO PS up, level shifters down, and power conditioning compomponents down a little to allow sliding board into enclosure without conflict, fixed silkscreen on P/L1,  changed part number on P/C6 to avoid confusion on whether part is 1210 or 0805
buildbotics_controller.pcb
footprints/38HTSSOP.fp
footprints/HSOP8.fp
footprints/Molex_39-30-0060.fp
footprints/SRN1060.fp
power.sch